Development / Diagnostics / Production Monitoring. Whether your customer is the individual consumer or an OEM, the TherMoiré excels at helping you achieve exceptional customer satisfaction. Better than ever, TherMoiré technology can simulate your thermal processing and operating environment conditions, while capturing a complete history of out-of-plane displacement behavior. Applying this critical information to form - or achieve compliance for - component/substrate behavior allowances (i.e. warpage specifications) can directly impact level I and level II assembly yields and enhance product reliability.
TherMoiré In-Process Warpage Measurement Systems
Dynamic Temperature Profiling - temperature ranges from -55 C to 300 C
Modular Metrology - Shadow Moiré, Digital Image Correlation, Micro Fringe Projection
Automated Analyses - Bow, Twist, Coplanarity, Camber, CTE, Surface Tilt, etc.
Data Management - Centralized database tools for production monitoring, trending and customer conformity/assurance requirements.
All of the above combine to provide users with a low cost per test, a clear ROI and a platform for long-term, value-added functionality across both development and production operations.
