Industry Standarts

Industry Standards

These standards are provided for reference purposes. Please visit respective websites of publishers for the most current release.

JEDEC JESD22-B112A - Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature

JEITA ED-7306 - Measurement methods of package warpage at elevated temperatureand the maximum permissible warpage

IPC-TM-650 TEST METHODS MANUAL

JEDEC JESD22-A104-B - Temperature Cycling

IPC/JEDEC J-STD-020D - Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

JEDEC JEP150 - Stress-Test-Driven Qualification of and Failure Mechanisms Associated with Assembled Solid State Surface-Mount Components

JEDEC JESD22B113 - Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products

JEDEC SPP-024, Issue A - Reflow Flatness Requirements for Ball Grid Array Packages

IPC 9641 - High Temperature Printed Board Flatness Guideline

IPC 7095C - Design and Assembly Process Implementation for BGAs